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2002-09 ～ 2005-06 Jiangxi Normal University The application of electronic technology

Technical School

Training

2011-09 ～ 2011-09 ASM Technology shenzhen ASM XTREME wire bonder training

2005-06 ～ 2005-09 Changan ASAT semiconductor assembly and test plant Eagle 60 welding wire machine training ASAT(UTAC) certificate 尋求電子方面的工作，特別是半導(dǎo)體行業(yè)，芯片封裝企業(yè)。

2)尋求COB無(wú)塵車(chē)間Camera Modules(攝像頭模組）的WB機(jī)器相關(guān)工作。

Work Experience0 years?

（2011-05 ～ 2013-0

4)

Company Type:

Private Enterprise Company Category:

Electrical,Micro-electronics

Job Title:

Equipment Engineer

Positions:

Chief Engineer

Job Description:

In the Lite-On group under the Silitek electronic (Guangzhou) Co., Ltd., is responsible for the WB ASM series and KS series welding machine machine and debugging in COB workshop, all kinds of problems and timely treatment machine in the production process, so that normal production. Training assessment on line operator, assist manager to make work instruction, make improvement on various problems during production, and submit the proposals to improve the electronic file

Reason for Leaving:

Come home to development ?

Project Experience

Changan ASAT semiconductor assembly and test plant （2005-06 ～ 2010-

10)

Job Title:

Equipment Technician

Project Description:

20005 June to 2010 November in Changan ASAT semiconductor assembly and test plant (now call UTAC) for more than five years, the factory for chip packaging enterprises, long-term production of various packaging chips, such as FPBGA TPGA EBGA LPCC TAPP QFP. I plant welding line department (wire bond) do technician team leader, has more than five years of chip manufacturing working experience, familiar with the former process and packaging technology, understand the chip manufacturing process. Job five years through long-term of study and practice has a weld line solid theoretical foundation and rich practical experience, proficient in welding line chip machine (especially ASM eagle60), can solve various problems of machine in the production process. There are multiple lines, long lines, super low line, multiple grains, some grains multilayer DIE, multilayer welding and BSOB welding wires problem as well as a variety of production process of difficult miscellaneous diseases. Proficient in OLP production. For the machine maintenance, repair and maintenance of I also very familiar with, for the repair and maintenance of production equipment have many years of work experience. I also line technician leader, responsible for the long-term production management area, grass-roots staff management capability of the production line

Responsibility:

ASM wire bonder related work

Special Skills

Professional Title:

Computer Level:

national computer exam. grade 3

Computer Skills:

Strengths:

Eight years wire bonding working experience, familiar with the ASM and KNS series wire bonders

Language Skills

Chinese:

Good Cantonese:

Good

English Level:

Spoken General

English:

General

Career Objective

Career Direction:

wire bonding machine related work

Self Info.

Self Assessment:?

For people: honest, generous, warm and cheerful

Work: diligent, good cooperation, rigorous style of work

Strong adaptability and self-learning ability,

Strong management, organizational ability

Hobbies:

Surf the Internet,Play games,Listen to the music,sports